A review of SiC power module packaging: Layout, material system and integration
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[2] R. Herzer. Integrated gate driver circuit solutions , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.
[3] Khai D. T. Ngo,et al. Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[4] Christopher Mark Johnson,et al. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process , 2011 .
[5] J. D. van Wyk,et al. High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment , 2007, IEEE Transactions on Advanced Packaging.
[6] Rabih Khazaka,et al. Endurance of Thin Insulation Polyimide Films for High-Temperature Power Module Applications , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[7] O. Lesaint,et al. Assessment of dielectric encapsulation for high temperature high voltage modules , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
[8] Fred C. Lee,et al. High-Frequency High Power Density 3-D Integrated Gallium-Nitride-Based Point of Load Module Design , 2013, IEEE Transactions on Power Electronics.
[9] Dehong Xu,et al. A Solution to Press-Pack Packaging of SiC MOSFETS , 2017, IEEE Transactions on Industrial Electronics.
[10] Puqi Ning,et al. Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).
[11] F. Barlow,et al. Thermal Cycling Reliability Study of Ag–In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[12] J. Schulz-Harder,et al. Recent developments of direct bonded copper (DBC) substrates for power modules , 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
[13] Peter Zacharias,et al. Prospects of GaN devices in automotive electrification , 2014 .
[14] D. Boroyevich,et al. A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications , 2014, IEEE Transactions on Power Electronics.
[15] D. Ibitayo,et al. Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[16] N. Seliger,et al. Planar Interconnect Technology for Power Module System Integration , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).
[17] W D Brown,et al. Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices , 2010, IEEE Transactions on Components and Packaging Technologies.
[18] Yu Chen,et al. On the Practical Design of a High Power Density SiC Single-Phase Uninterrupted Power Supply System , 2017, IEEE Transactions on Industrial Informatics.
[19] Tien-Yu Lee. Design optimization of an integrated liquid-cooled IGBT power module using CFD technique , 2000 .
[20] Khai D. T. Ngo,et al. DBC switch module for management of temperature and noise in 220-W/in 3 power assembly , 2015, APEC 2015.
[21] P.O. Jeannin,et al. Study and realization of a low force 3D press-pack power module , 2008, 2008 IEEE Power Electronics Specialists Conference.
[22] Philippe Godignon,et al. Monolithically Integrated Temperature Sensor in Silicon Carbide Power MOSFETs , 2014, IEEE Transactions on Power Electronics.
[23] Dushan Boroyevich,et al. Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging , 2012 .
[24] S. Klengel,et al. Packaging material issues in high temperature power electronics , 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).
[25] L. Mendizabal,et al. Survey of High-Temperature Reliability of Power Electronics Packaging Components , 2015, IEEE Transactions on Power Electronics.
[26] Alex Q. Huang,et al. 6.5 kV Si/SiC hybrid power module: An ideal next step? , 2015, 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP).
[27] Allen R. Hefner,et al. Thermo-Mechanical Characterization of Au-In Transient Liquid Phase Bonding Die-Attach , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[28] Wensong Yu,et al. Design and application of a 1200V ultra-fast integrated Silicon Carbide MOSFET module , 2016, 2016 IEEE Applied Power Electronics Conference and Exposition (APEC).
[29] Jean-Christophe Crebier,et al. 3D hybrid integration and functional interconnection of a power transistor and its gate driver , 2010, 2010 IEEE Energy Conversion Congress and Exposition.
[30] Kai Kriegel,et al. Evaluation of enhanced power modules with planar interconnection technology for aerospace application , 2014 .
[31] M. Glover,et al. Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles , 2012, 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC).
[32] Guoyou Liu,et al. Thermal design of a dual sided cooled power semiconductor module for hybrid and electric vehicles , 2017, 2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
[33] Y. Joshi,et al. Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins , 2001 .
[34] Yu Chen,et al. An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications , 2017, IEEE Transactions on Industrial Electronics.
[35] S. Haumann,et al. Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density , 2013, 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC).
[36] Y. Ikuhara,et al. Direct bonded aluminum on aluminum nitride substrates via a transient liquid phase and its application , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.
[37] S. Tiwari,et al. Comparative evaluation of a commercially available 1.2 kV SiC MOSFET module and a 1.2 kV Si IGBT module , 2016, IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society.
[38] F. Udrea,et al. Comparative analysis of static and switching performance of 1.2 kV commercial SiC transistors for high power density applications , 2013, The 1st IEEE Workshop on Wide Bandgap Power Devices and Applications.
[39] Sang Won Yoon,et al. Double-sided nickel-tin transient liquid phase bonding for double-sided cooling , 2014, 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014.
[40] Song Bai,et al. Design and Application of High-Voltage SiC JFET and Its Power Modules , 2016, IEEE Journal of Emerging and Selected Topics in Power Electronics.
[42] Chee Lip Gan,et al. Transient liquid phase Ag-based solder technology for high-temperature packaging applications , 2014 .
[43] Bastian Vogler,et al. Integration of 1200V SOI gate driver ICs into a medium power IGBT module package , 2010, 2010 22nd International Symposium on Power Semiconductor Devices & IC's (ISPSD).
[44] O. Løvvik,et al. High Temperature Interconnect and Die Attach Technology: Au–Sn SLID Bonding , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[45] C. Gillot,et al. Double-sided cooling for high power IGBT modules using flip chip technology , 2001 .
[46] G. Lu,et al. Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips , 2010, IEEE Transactions on Components and Packaging Technologies.
[47] Thomas Stockmeier,et al. SKiN: Double side sintering technology for new packages , 2011, 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs.
[48] Ralph M. Burkart,et al. Comparative evaluation of SiC and Si PV inverter systems based on power density and efficiency as indicators of initial cost and operating revenue , 2013, 2013 IEEE 14th Workshop on Control and Modeling for Power Electronics (COMPEL).
[49] J. Franke,et al. Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding , 2013, 2013 3rd International Electric Drives Production Conference (EDPC).
[50] Silicon carbide power electronic module packaging , 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
[51] Puqi Ning,et al. A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling , 2014, IEEE Journal of Emerging and Selected Topics in Power Electronics.
[52] J.D. van Wyk,et al. High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications , 2007, IEEE Transactions on Power Electronics.
[53] M. Glover,et al. Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems , 2014, IEEE Journal of Emerging and Selected Topics in Power Electronics.
[54] Jean-Christophe Crebier,et al. A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration , 2010, IEEE Transactions on Industry Applications.
[55] R. Schmidt,et al. Novel wire bond material for advanced power module packages , 2012, Microelectron. Reliab..