A Novel Converter-level Online Junction Temperature Estimating Method for SiC MOSFETs Based on the Current Oscillation of DC and AC sides in a Single Phase Inverter

SiC power devices have been increasingly used in industrial applications. Junction temperature estimating is the basis of high reliability operation for SiC devices, since thermal stress is one of the dominating failure inducing factors. Thermal sensitive electrical parameter (TSEP) methods have been widely used for junction temperature estimating for the advantage in low invasiveness and fast response speed. However, conventional TSEP methods merely focus on a single semiconductor device instead of a converter, which results in high cost and difficulty in integration. Low sensitivity is another limitation. To solve the problems, a high-sensitivity converter-level online junction temperature estimating method is proposed in this paper based on the current oscillation (ΔiOS) of DC and AC sides in a single-phase inverter. Theoretical analysis is provided to illustrate why ΔiOS can serve as a converter-level junction temperature (Tj) indicator. The relationship between ΔiOS and Tj is obtained by experiment for calibration based on a dual pulse test. Online experiment for Tj estimating based on a single-phase inverter is provided to verify the effectiveness of the proposed method.

[1]  Pinjia Zhang,et al.  An Online Junction Temperature Monitoring Method for SiC MOSFETs Based on a Novel Gate Conduction Model , 2021, IEEE Transactions on Power Electronics.

[2]  Z. Shen,et al.  Online Junction Temperature Measurement for SiC MOSFET Based on Dynamic Threshold Voltage Extraction , 2021, IEEE Transactions on Power Electronics.

[3]  B. Akin,et al.  Turn-on Delay Based Real-Time Junction Temperature Measurement for SiC MOSFETs With Aging Compensation , 2021, IEEE Transactions on Power Electronics.

[4]  P. Ning,et al.  Monitoring of SiC MOSFET junction temperature with on-state voltage at high currents , 2020, Chinese Journal of Electrical Engineering.

[5]  L. Tolbert,et al.  Online Junction Temperature Monitoring Using Intelligent Gate Drive for SiC Power Devices , 2019, IEEE Transactions on Power Electronics.

[6]  Gianmario Pellegrino,et al.  Online Junction Temperature Estimation of SiC Power mosfets Through On-State Voltage Mapping , 2018, IEEE Transactions on Industry Applications.

[7]  Yu Du,et al.  A measurement method to extract the transient junction temperature profile of power semiconductors at surge conditions , 2017, 2017 IEEE Energy Conversion Congress and Exposition (ECCE).

[8]  Yung C. Liang,et al.  A simple approach on junction temperature estimation for SiC MOSFET dynamic operation within safe operating area , 2015, 2015 IEEE Energy Conversion Congress and Exposition (ECCE).

[9]  L. Tolbert,et al.  A high temperature silicon carbide MOSFET power module with integrated silicon-on-insulator based gate drive , 2014, 2014 IEEE Energy Conversion Congress and Exposition (ECCE).

[10]  Matthias Petzold,et al.  Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds , 2012 .

[11]  Dawei Xiang,et al.  An Industry-Based Survey of Reliability in Power Electronic Converters , 2011, IEEE Transactions on Industry Applications.

[12]  B. Jayant Baliga,et al.  Fundamentals of Power Semiconductor Devices , 2008 .

[13]  Pinjia Zhang,et al.  A Novel Online Chip-Related Aging Monitoring Method for IGBTs Based on the Leakage Current , 2023, IEEE Transactions on Industrial Electronics.