Residual stress measurements on chromium films by x-ray diffraction using the sin2ψ method

Abstract Residual stresses in chromium films vacuum deposited by electron beam evaporation onto beryllium substrates were measured by X-ray diffraction. A minute peak shift of the diffraction profile reveals the presence of strain and hence stress. Detection of the shift was made possible by fitting the experimental data to a modified Lorentz function and by then subjecting the fit to a regression analysis. Computer aid was utilized extensively. Stresses, both tensile and compressive, of 10 9 –10 10 dyn cm -2 were found for substrate temperatures in the range 300– 550 °C. Stress mechanisms are discussed.

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