Si3N4 Manifold Microchannels Cooling System for High Heat Flux Electronic Applications

The increasing energy dissipation in more compact and powerful electronic systems has led to extreme high heat fluxes which call for more effective thermal management solutions. [1] One innovative cooling strategy to meet the dissipation demand is two-phase cooling utilizing manifold-microchannels, it can achieve high heat transfer while maintaining low pressure drops in comparison to conventional two-phase microchannels. For electronics cooling in extreme environment, Si3N4-based ceramic is an ideal substrate due to its high thermal conductivity, low elastic modulus, and sufficient strength and toughness. In this study, a reduced order thermal-fluidic analysis of Si3N4 manifold-microchannel for two-phase boiling flows is conducted for dissipating up to 1 kW of heat from a 1 cm2 heated area on a compact Si3N4 sample. The effect of manifold-microchannel geometry parameters on pressure drop and heat resistance are investigated. The performances of different type of working fluids are also compared, including R134a, R1234yf, R1234ze(E), R245fa, and R1233zd, FC72, and HFE7100. The proposed manifold-microchannels with R134a as the working fluid can achieve low pressure drop ~20 kPa and low thermal resistance ~0.06 K/W with a mass flow rate requirement of 9~ 13 g/s for a heat flux of 1 kW/cm2.

[1]  Chirag R. Kharangate,et al.  Investigation of 3D manifold architecture heat sinks in air-cooled condensers , 2020 .

[2]  A. Agrawal,et al.  A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling , 2019, Sādhanā.

[3]  M. Ohadi,et al.  Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps - R245fa Empirical Results , 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

[4]  Kenneth E. Goodson,et al.  Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications , 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

[5]  A. Shooshtari,et al.  Heat transfer and pressure drop characteristics of a flat plate manifold microchannel heat exchanger in counter flow configuration , 2016 .

[6]  Issam Mudawar,et al.  Review of databases and predictive methods for pressure drop in adiabatic, condensing and boiling mini/micro-channel flows , 2014 .

[7]  I. Mudawar,et al.  Universal approach to predicting saturated flow boiling heat transfer in mini/micro-channels – Part I. Dryout incipience quality , 2013 .

[8]  I. Mudawar,et al.  Universal approach to predicting two-phase frictional pressure drop for mini/micro-channel saturated flow boiling , 2013 .

[9]  M. Ohadi,et al.  Next Generation Microchannel Heat Exchangers , 2012 .

[10]  I. Mudawar.  Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations , 2011 .

[11]  S. Dash,et al.  Two‐phase pressure drop caused by sudden flow area contraction/expansion in small circular pipes , 2011 .

[12]  A. Fleischer,et al.  Experimental Investigation of the Thermal Performance of Graphite Foam for Evaporator Enhancement in Both Pool Boiling and an FC-72 Thermosyphon , 2009 .

[13]  Michael M. Ohadi,et al.  Experimental investigation of heat transfer performance of a manifold microchannel heat sink for cooling of concentrated solar cells , 2009, 2009 59th Electronic Components and Technology Conference.

[14]  Dimos Poulikakos,et al.  Efficiency of optimized bifurcating tree-like and parallel microchannel networks in the cooling of electronics , 2009 .

[15]  Michael Ohadi,et al.  Force-fed evaporation and condensation utilizing advanced micro-structured surfaces and micro-channels , 2008, Microelectron. J..

[16]  S. Garimella,et al.  Towards a Thermal Moore's Law , 2007, IEEE Transactions on Advanced Packaging.

[17]  D. Poulikakos,et al.  Laminar mixing, heat transfer and pressure drop in tree-like microchannel nets and their application for thermal management in polymer electrolyte fuel cells , 2004 .

[18]  Lanchao Lin,et al.  Heat transfer characteristics of spray cooling in a closed loop , 2003 .

[19]  I. Mudawar,et al.  Flow boiling heat transfer in two-phase micro-channel heat sinks––I. Experimental investigation and assessment of correlation methods , 2003 .

[20]  H. Lee,et al.  Heat transfer correlation for boiling flows in small rectangular horizontal channels with low aspect ratios , 2001 .

[21]  Adrian Bejan,et al.  Deterministic Tree Networks for Fluid Flow: Geometry for Minimal Flow Resistance Between a Volume and One Point , 1997 .

[22]  D. C. Wadsworth,et al.  Enhancement of Single-Phase Heat Transfer and Critical Heat Flux From an Ultra-High-Flux Simulated Microelectronic Heat Source to a Rectangular Impinging Jet of Dielectric Liquid , 1992 .

[23]  G. Beretta,et al.  Boiling regimes in a closed two-phase thermosyphon , 1990 .

[24]  M. Monde,et al.  Critical heat flux in saturated forced convective boiling on a heated disk with multiple impinging jets , 1987 .