论文信息 - Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages - 字舞流文

Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

Wei Wang | Dingyou Zhang | Jiantao Zheng | A. Syed | M. Shah | M. Schwarz | YangYang Sun | D. Rae | Lily Zhao