Method for mounting a camera module

A method for mounting a camera module is provided to save manufacturing cost and improve productivity because an additional component is not used to connect the camera module by directly mounting the camera module on an apparatus-side PCB(Printed Circuit Board) by using SMT(Surface Mounting Technique). A heat protecting cap(50) is covered on an external side of an assembled camera module(40). A cream solder is coated on a pad of a PCB(100) of an apparatus like a mobile phone in which the camera module(40) will be mounted. The camera module(40) on which the heat protecting cap(50) is covered is mounted on the cream solder of the pad of the PCB(100). The mounted camera module(40) is fixed and electrically connected on the PCB(100) through the reflow soldering which heats the PCB(100) on which the camera module(40) is mounted. The heat protecting cap(50) is separated and removed from the camera module(40) combined and connected on the PCB(100).