Dynamic reliability approach of chip scale package assembly under vibration environment

Purpose – The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong fatigue life of CSP assembly are provided. Design/methodology/approach – The CSP assembly which contains different package structure modes and chip positions was manufactured. The fatigue characteristics of CSP assembly under vibration were tested. The fatigue load spectrum of CSP assembly was developed under different excitation. The fatigue life of chips can be estimated by using the high-cycle fatigue life formula based on different stress conditions. The signal–noise curve shows the relationship between fatigue life and key factors. The design strategy for improving the fatigue life of CSP assembly was discussed. Findings – The CSP chip has longer fatigue life than the ball grid array chip under high cyclic strain. The closer to fixed point the CSP chip, the longer fatigue life chips will have. The chip at the edge ...

[1]  Nikhil Lakhkar,et al.  Effect of structural design parameters on wafer level CSP ball shear strength and their influence on accelerated thermal cycling reliability , 2009 .

[2]  M. Pecht,et al.  Standards for Tin Whisker Test Methods on Lead-Free Components , 2009, IEEE Transactions on Components and Packaging Technologies.

[3]  S. C. Hung,et al.  An experimental study of failure and fatigue life of a stacked CSP subjected to cyclic bending , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[4]  Haiyu Qi,et al.  A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions , 2009, IEEE Transactions on Components and Packaging Technologies.

[5]  Freddy Chan,et al.  Design Strategy to Optimize the Reliability of Grid-Connected PV Systems , 2009, IEEE Transactions on Industrial Electronics.

[6]  Krishnaswami Srihari,et al.  Assembly reliability assessment and life estimation for a stacked area array device , 2010, Microelectron. Reliab..

[7]  H.L.J. Pang,et al.  Vibration reliability test of a PBGA assembly , 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).

[8]  Ping Yang,et al.  Numerical investigation on the thermal reliability and layout optimisation of printed circuit board level , 2012 .

[9]  H.L.J. Pang,et al.  Vibration fatigue test and analysis for flip chip solder joints , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[10]  Pradeep Lall,et al.  Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments , 2007 .

[11]  Fook Fah Yap,et al.  Reliability of PBGA assemblies under out-of-plane vibration excitations , 2002 .

[12]  Cédric Le Coq,et al.  Optimization for simulation of WL-CSP subjected to Drop-Test with plasticity behavior , 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

[13]  Ping Yang,et al.  Experimental Approach and Evaluation on Dynamic Reliability of PBGA Assembly , 2009, IEEE Transactions on Electron Devices.

[14]  Nikhil Lakhkar,et al.  Mechanical design optimization of a package on package , 2009 .

[16]  Tianbo Li,et al.  Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes , 2012 .

[17]  Ping Yang,et al.  Physical Mechanism of Interfacial Thermal Resistance in Electronic Packaging Based on a Mixed MD/FE Model , 2008, IEEE Transactions on Advanced Packaging.

[18]  Umesh Sharma,et al.  Low profile CSP (LP-CSP) technology for ultra-thin IC packaging applications , 2010, 3rd Electronics System Integration Technology Conference ESTC.