Modeling the performance of embedded gridded plane structures in LTCC
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A new simulation approach for embedded solidgridded plane structures in LTCC circuits is proposed. Simulation and experimental results based on this approach for several solidgridded benchmark structures are presented. The influence of the physical parameters of gridded planes on the electrical behavior of the plane structures is discussed. I. Introduction One of the advantages offered by multi-layer low temperature co-fned ceramic (LTCC) technology is the realization of 3D circuit components, such as buried resistors, capacitors, and inductors withim the LTCC. Besides these components, an embedded power delivery system may be used in multi-layer LTCC circuit applications as well. Solidgridded or gridded planes should be used in embedded power delivery systems realized in LTCC multi-layer designs due to lamination issues and material shrinkage during the LTCC fabrication process. New techniques to model and characterize the behavior of these embedded structures are required with the increase of the clock and carrier frequencies. and circuit density. In [l] and [2], a method for modeling solidgridded poweriground plane structures in LTCC modules over a broad frequency band was presented, and the simulated Sll results of some benchmark structures were compared with measured results. The results presented in [I] and [2] were specifically for the case where both ground planes reside on outer LTCC layers (i.e., they are not embedded). This paper extends the method presented in [l] and [2] and presents a hybrid simulation method for the analysis of structures with embedded gridded planes. Two benchmark circuits with embedded structure design are simulated. Simulated and measured SI1 results of different gridded plane designs are illustrated. The results presented in [2] show that the behavior of solidgridded planes changes when the physical parameters of the gridded plane change. In this paper, the impact of these changes on the characteristics of embedded gridded plane structures is investigated. lI. LTCC SnlidGridded Plane Design Considerations
[1] Guang Chen,et al. Frequency domain behavior of solid and gridded reference power/ground planes in LTCC modules , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
[2] John L. Prince,et al. Accurate frequency domain modeling of LTCC solid‐gridded plane structures , 2003 .