Influence of ALD Ru bottom electrode on ferroelectric properties of Hf0.5Zr0.5O2-based capacitors

We report the influence of an ultrathin Ru bottom electrode on ferroelectric properties of fully atomic layer deposition (ALD)-grown Hf0.5Zr0.5O2 (HZO) and La-doped Hf0.5Zr0.5O2 (HZLO)-based ferroelectric capacitors. We show that the Ru bottom electrode deposited by radical enhanced ALD (REALD) improves the remanent polarization of both capacitors considerably. The origin of such a phenomenon is established by grazing-incidence and symmetrical θ–2θ x-ray diffraction measurements. HZO films on Ru exhibit the orthorhombic phase, which is highly (002)-textured in the out-of-plane direction as compared to HZO on TiN. HZLO films demonstrate the rise of (111) intensity of the orthorhombic phase when it is grown on Ru. Both types of capacitors with Ru exhibit a lower wake-up degree as compared to the ones with TiN, which is assumed to be due to the difference in the bottom interface properties. At the same time, both HZO and HZLO on Ru suffer from the relatively early breakdown during electric field cycling, which is presumably due to the high surface roughness of REALD Ru. Taking into account the continuous search for the new precursor's chemicals and ALD processes for Ru, which would be able to provide smother films, ALD Ru might be promising for the hafnium oxide-based ferroelectric random access memory.

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