Microarchitecture level power and thermal simulation considering temperature dependent leakage model

In this paper, we present power models with clock and temperature scaling, and develop a first-of-its-type coupled thermal and power simulation with a temperature-dependent leakage power model at the microarchitecture level. We show that leakage energy and total energy can be different by up to 2.5/spl times/ and 2/spl times/ for temperatures between 90/spl deg/C and 130/spl deg/C, respectively. Given such big energy variations, no power model at the microarchitecture level is accurate without considering temperature dependent leakage models.