Combination of thermal subsystems modeled by rapid circuit transformation

This paper will deal with the modeling-problem of combining thermal subsystems (e.g. a semiconductor module or package with a cooling radiator) making use of reduced models. The subsystem models consist of a set of Foster-type thermal equivalent circuits, which are only behavioral models. A fast algorithm is presented for transforming the Foster-type circuits in Cauer-circuits which have physical behavior and therefore allow for the construction of the thermal model of the complete system. Then the set of Cauer-circuits for the complete system is transformed back into Foster-circuits to give a simple mathematical representation and applicability. The transformation algorithms are derived in concise form by use of recursive relations. The method is exemplified by modeling and measurements on a single chip IGBT package mounted on a closed water cooled radiator. The thermal impedance of the complete system is constructed from the impedances of the subsystems, IGBT-package and radiator, and also the impedance of the package can be inferred from the measured impedance of the complete system.

[1]  Y.C. Gerstenmaier,et al.  Efficient calculation of transient temperature fields responding to fast changing heatsources over long duration in power electronic systems , 2004, IEEE Transactions on Components and Packaging Technologies.

[2]  H. Pape,et al.  Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

[3]  P. Stehouwer,et al.  Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

[4]  Michael B. Steer,et al.  Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems , 2001 .

[5]  Bart Vandevelde,et al.  A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package , 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A.

[6]  G. Wachutka,et al.  Calculation of the temperature development in electronic systems by convolution integrals , 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

[7]  Marta Rencz,et al.  Dynamic thermal multiport modeling of IC packages , 2001 .

[8]  V. Székely,et al.  Fine structure of heat flow path in semiconductor devices: a measurement and identification method , 1988 .

[9]  M. Rencz,et al.  Studies on the nonlinearity effects in dynamic compact model generation of packages , 2004, IEEE Transactions on Components and Packaging Technologies.

[10]  V. Szekely,et al.  Identification of RC networks by deconvolution: chances and limits , 1998 .

[11]  Paolo Maffezzoni,et al.  Nonlinear Projection-Based Approach for Generating Compact Models of Nonlinear Thermal Networks , 2006 .

[12]  A. Castellazzi,et al.  Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions , 2006, IEEE Transactions on Power Electronics.

[13]  Gerhard Wachutka,et al.  Rigorous model and network for transient thermal problems , 2002 .

[14]  J. D. Parry,et al.  The world of thermal characterization according to DELPHI-Part I: Background to DELPHI , 1997 .

[15]  M.-N. Sabry,et al.  Static and dynamic thermal modeling of ICs , 1999 .

[16]  Gerhard Wachutka,et al.  Rigorous model and network for static thermal problems , 2002 .

[17]  J. C. Jaeger,et al.  Conduction of Heat in Solids , 1952 .

[18]  J. W. Sofia.  Analysis of thermal transient data with synthesized dynamic models for semiconductor devices , 1994 .

[19]  Franklin Fa-Kun Kuo,et al.  Network analysis and synthesis , 1962 .