멀티칩 구조를 가지는 블루투스 모듈의 수명예측

This study explains and predicts B₁? life by using ALT(Accelerated Life Test) for a multi-chip Bluetooth module which is becoming one of the most important component in electric appliances. The failure mode/mechanism of Bluetooth module can be classified into three groups but this paper mostly focuses on the dominant failure mode/mechanism which is open due to cracks and delaminations inside the module. This failure mode/mechanism is tested by using thermal shock as a stress. Through this study, we have estimated that B₁? life of the multi-chip Bluetooth module is l495cycles when ΔT is 125℃.