Quantification of stickiness using a pressure distribution sensor

We developed and evaluated a device aiming at quantifying stickiness. A typical pressure distribution sensor can measure a pressing force but cannot measure a tensile force. We therefore installed a pin array on a sensor, with the pin array applying an offset pressure to the sensor through its weight. Furthermore, a subjective stickiness evaluation and measurement of the adhesive force were performed for an actual sample, and the correlation between evaluations and measurements was preliminarily investigated.