High-speed high-density parallel free-space optical interconnections

Summary form only given. Modules which implement high-density parallel free-space board-to-board optical interconnections have been constructed with linear arrays of components. These free-space optical interconnections provide the capability for dense z-axis interconnections perpendicular to boards or multichip modules. Each parallel interconnection contains an edge-emitting InGaAs laser array, transmitter and receiver lens arrays, and an InGaAs detector array flip-chip attached to a GaAs heterojunction bipolar transistor amplifier array.