From tribological coatings to low-k dielectrics for ULSI interconnects
暂无分享,去创建一个
[1] A. Grill. Amorphous carbon based materials as the interconnect dielectric in ULSI chips , 2001 .
[2] A. Grill,et al. Novel Low k Dielectrics Based on Diamondlike Carbon Materials , 1998 .
[3] Masao Yamada,et al. Plasma‐Enhanced Chemical Vapor Deposition of Fluorocarbon Films with High Thermal Resistance and Low Dielectric Constants , 1997 .
[4] Stephan A. Cohen,et al. Electrical resistivities of diamond-like carbon , 1994 .
[5] J. Dismukes,et al. Synthetic diamond: emerging CVD science and technology , 1994 .