Breaking stress of glass welded with femtosecond laser pulses at high repetition rates

We report on measurements of the breaking stress of glass substrates welded with ultrashort laser pulses. Femtosecond laser pulses at repetition rates in the MHz range are focused at the interface between two substrates, resulting in multiphoton absorption and heat accumulation from successive pulses. This leads to local melting and subsequent resolidification results in the formation of strong bonds at the interface. The achievable breaking stress of this flexible and local bonding process is discussed in detail in dependence of the processing parameters.

[1]  F. Yoshino,et al.  Fusion Welding of Glass Using Femtosecond Laser Pulses with High-repetition Rates , 2007 .

[2]  Liwei Lin,et al.  The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask , 2002 .

[3]  J. Nishii,et al.  Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses , 2006 .

[4]  Hongyu Zheng,et al.  Laser-effected darkening in TPEs with TiO2 additives , 2004 .

[5]  Bob Goss,et al.  Bonding glass and other substrates with UV curing adhesives , 2002 .

[6]  Stephen C. Jacobson,et al.  Low temperature bonding for microfabrication of chemical analysis devices , 1997 .

[7]  Jan Haisma,et al.  Contact bonding, including direct-bonding in a historical and recent context of materials science and technology, physics and chemistry historical review in a broader scope and comparative outlook , 2002 .

[8]  E. M. Liston Plasma Treatment for Improved Bonding: A Review , 1989 .

[9]  E. Mazur,et al.  Bulk heating of transparent materials using a high-repetition-rate femtosecond laser , 2003 .

[10]  Eric Mazur,et al.  Laser-induced breakdown and damage in bulk transparent materials induced by tightly focused femtosecond laser pulses , 2001 .

[11]  Kazuyoshi Itoh,et al.  Ultrafast laser microwelding for transparent and heterogeneous materials , 2008, SPIE LASE.

[12]  Suresh T. Gulati,et al.  ULE - Zero expansion, low density, and dimensionally stable material for lightweight optical systems , 1997, Optics + Photonics.

[13]  M. Shimbo,et al.  Silicon‐to‐silicon direct bonding method , 1986 .

[14]  M. Vellekoop,et al.  Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers , 2000 .

[15]  Andreas Tünnermann,et al.  Ultrafast laser processing: New options for three-dimensional photonic structures , 2004 .

[16]  J. Gottmann,et al.  Local Melting of Glass Material and Its Application to Direct Fusion Welding by Ps-laser Pulses , 2007 .

[17]  Stephen Ho,et al.  Transition from thermal diffusion to heat accumulation in high repetition rate femtosecond laser writing of buried optical waveguides. , 2008, Optics express.

[18]  J. Nishii,et al.  Welding of Transparent Materials Using Femtosecond Laser Pulses , 2005 .