Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications

The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated both experimentally and numerically to offer a cost-effective approach realizing power supply system-on-chip (PSoC) or system-in-package (PSiP). Improvement in total inductance and Q factor is demonstrated for the multiturn bondwire inductors due to the coupling effect. An empirical calculation method is developed to help determine the self and mutual inductance of the proposed bondwire inductors. The bondwire magnetic components can be easily integrated into IC packaging processes with minimal changes, and open possibilities for realizing cost-effective, high-current, and high-efficiency PSoCs or PSiPs.

[1]  S.C.O. Mathuna,et al.  Magnetics on silicon: an enabling technology for power supply on chip , 2005, IEEE Transactions on Power Electronics.

[2]  William B. Kuhn,et al.  Printed microinductors on flexible substrates for power applications , 2003 .

[3]  Y. Katayama,et al.  High-power-density MHz-switching monolithic DC-DC converter with thin-film inductor , 2000, 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018).

[4]  I. Batarseh,et al.  Design and Fabrication of Integrated Power Inductor Based on Silicon Molding Technology , 2007, 2007 IEEE Power Electronics Specialists Conference.

[5]  Xun Gong,et al.  On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip , 2008 .

[6]  Mark G. Allen,et al.  Micromachined planar inductors on silicon wafers for MEMS applications , 1998, IEEE Trans. Ind. Electron..

[7]  H. Greenhouse,et al.  Design of Planar Rectangular Microelectronic Inductors , 1974 .

[8]  Tetsuo Inoue,et al.  Planar inductor with ferrite layers for DC-DC converter , 2003 .

[9]  Michiel Steyaert,et al.  A 1.8-GHz CMOS low-phase-noise voltage-controlled oscillator with prescaler , 1995, IEEE J. Solid State Circuits.

[10]  S. J. Croall,et al.  Electromagnetic Voltage Induction and Mitigation on Passive Conductors from Overhead Transmission Lines , 1983, IEEE Transactions on Power Apparatus and Systems.

[11]  Rao Tummala,et al.  Magnetic nanocomposites for organic compatible miniaturized antennas and inductors , 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

[12]  S. Han,et al.  A megahertz switching DC/DC converter using FeBN thin film inductor , 2002 .

[13]  E. Brandon,et al.  Fabrication and characterization of microinductors for distributed power converters , 2003 .

[14]  Jian Lu,et al.  On-Chip Bondwire Inductor with Ferrite-Epoxy Coating: A Cost-Effective Approach to Realize Power Systems on Chip , 2007, 2007 IEEE Power Electronics Specialists Conference.

[15]  Xun Gong,et al.  On-chip bondwire transformers for power SOC applications , 2008, 2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and Exposition.

[16]  Yongsoo Oh,et al.  Planar inductor with ferrite layers for DC-DC converter , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

[17]  M. Allen,et al.  Batch-fabricated microinductors with electroplated magnetically anisotropic and laminated alloy cores , 1999 .