论文信息 - Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects - 字舞流文

Assessing Ultrathin Wafer-Scale WS2 as a Diffusion Barrier for Cu Interconnects

U. Mirsaidov | B. Conran | S. Vajandar | Simonas Krotkus | Sergej Pasko | Salim El Kazzi | Ya Woon Lum | Ivan Erofeev | Oliver Whear | Thomas Osipowicz