Design of integrated-circuit interconnects with accurate modeling of chemical-mechanical planarization
暂无分享,去创建一个
Jinjun Xiong | Andrew B. Kahng | Lei He | King Ho Tam | A. Kahng | Jinjun Xiong | Lei He | K. Tam
[1] Yu Chen,et al. Performance-impact limited-area fill synthesis , 2003, SPIE Advanced Lithography.
[2] Jinjun Xiong,et al. Simultaneous buffer insertion and wire sizing considering systematic CMP variation and random leff variation , 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
[3] D. Boning,et al. A MATHEMATICAL MODEL OF PATTERN DEPENDENCIES IN Cu CMP PROCESSES , 1999 .
[4] Puneet Gupta,et al. Manufacturing-aware physical design , 2003, ICCAD-2003. International Conference on Computer Aided Design (IEEE Cat. No.03CH37486).
[5] Puneet Gupta,et al. Performance-impact limited area fill synthesis , 2003, DAC '03.
[6] Sani R. Nassif,et al. A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance , 2000, Proceedings 37th Design Automation Conference.
[7] Ruiqi Tian,et al. Reticle enhancement technology: implications and challenges for physical design , 2001, Proceedings of the 38th Design Automation Conference (IEEE Cat. No.01CH37232).
[8] Tamba Gbondo-Tugbawa,et al. Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes , 2002 .
[9] Runzi Chang. Integrated CMP Metrology and Modeling With Respect To Circuit Performance , 2004 .