The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging
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Chak-Kuen Wong | John H. L. Pang | J. W. Tew | B. K. Lok | H. J. Lu | F. L. Ng | Y. F. Sun | J. Pang | F. L. Ng | B. Lok | Y. Sun | H. Lu | J. Tew | Chak-Kuen Wong
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