Reliability physics in electronics: a historical view

This paper traces the development of the reliability approach for microelectronic devices. It discusses the pressures on the early military microelectronics industry to improve the reliability of individual parts making up the complex equipment. This pressure led to the need for a new approach to designing and evaluating these parts. The resulting birth of reliability physics is covered in detail, followed by the subsequent growth and eventually the creation of many specialty areas within reliability physics.

[1]  D. S. Peck,et al.  The Analysis of Data from Accelerated Stress Tests , 1971 .

[2]  Robert W. Thomas Microcircuit Package Gas Analysis , 1976, 14th International Reliability Physics Symposium.

[3]  Robert J. Anstead Failure Analysis using a Scanning Electron Microscope , 1967 .

[4]  C. W. Lewis,et al.  Physics of Resistor Failure , 1962 .

[5]  J. S. Smith Electrical Overstress Failure Analysis in Microcircuits , 1978, 16th International Reliability Physics Symposium.

[6]  M. Rocci,et al.  A Technique for Controllable Acceleration and Prediction of Degradation Mechanisms of Electronic Parts , 1965 .

[7]  George H. Ebel High Temperature Reverse Bias Testing at Wafer Level , 1972 .

[8]  J. R. Haberer Photoresponse Mapping of Semiconductors , 1966 .

[9]  Jayne Partridge On the Extrapolation of Accelerated Stress Conditions to Normal Stress Conditions of Germanium Transistors , 1963 .

[10]  H. Schafft,et al.  Characteristics of "Second Breakdown" and Transistor Failure , 1962 .

[11]  T. May,et al.  A New Physical Mechanism for Soft Errors in Dynamic Memories , 1978, 16th International Reliability Physics Symposium.

[12]  J. J. Licari,et al.  Properties of Plastic Materials and How They Relate to Device Failure Mechanisms , 1965 .

[13]  C. S. Tsai,et al.  Diagnosis of Hybrid Microelectronics using Transmission Acoustic Microscopy , 1979, 17th International Reliability Physics Symposium.

[14]  W. Shurtleff,et al.  A Limitation to the Step Stress Testing Concept for Integrated Circuits , 1965 .

[15]  Clifford M. Ryerson Project Control to Provide for the Physics of Failure in Electronics , 1962 .

[16]  D. Peck,et al.  The Design and Evaluation of Reliable Plastic-Encapsulated Semiconductor Devices , 1970 .

[17]  G.H. Ebel Failure Analysis Techniques Applied in Resolving Hybrid Microcircuit Reliability Problems , 1977, 15th International Reliability Physics Symposium.

[18]  A. Christou,et al.  Ionic Contamination-Humidity Effects on GaAs FETs , 1979, 17th International Reliability Physics Symposium.

[19]  Alex Shumka,et al.  Migrated-Gold Resistive Shorts in Microcircuits , 1975, 13th International Reliability Physics Symposium.

[20]  Charles Libove Rectangular Flat-Pack Lids Under External Pressure: Formulas for Screening and Design , 1975, 13th International Reliability Physics Symposium.

[21]  Elliott Philofsky Purple Plague Revisited , 1970 .

[22]  Jayne Partridge,et al.  The Application of Failure Analysis in Procuring and Screening of Integrated Circuits , 1965 .

[23]  D. S. Peck New Concerns About Integrated Circuit Reliability , 1978, 16th International Reliability Physics Symposium.

[24]  Joseph Vaccaro Reliability and the Physics of Failure Program at RADC , 1962 .

[25]  E. E. Davidson,et al.  Reliability Implications of Hot Electron Generation and Parasitic Bipolar Action in an IGFET Device , 1976, 14th International Reliability Physics Symposium.

[26]  Joseph B. Brauer,et al.  Can Plastic Encapsuiated Microcircuits Provide Reliability with Economy , 1970 .

[27]  David W. Levinson,et al.  Failure Physics: an Essential Discipline for Reliability Engineering , 1962 .

[28]  J. Kozol,et al.  Failure Physics and Accelerated Testing , 1963 .

[29]  George H. Ebel Physics of Failure in Commercialand , 1964 .

[30]  C. A. Bosselaar Critical Remarks on the Use of Streoscan Electron Microscopes for the Investigation of the Electrical Parameters of Semiconductor Surfaces , 1967 .

[31]  L. Zakraysek Intermetallic Characterization , 1973 .

[32]  L. Hamiter,et al.  EBIC - A Valuable Tool for Semiconductor Evaluation and Failure Analysis , 1977, 15th International Reliability Physics Symposium.

[33]  George G. Harman A Metallurgical Basis for the Non-Destructive Wire-Bond Pull-Test , 1974 .

[34]  G. Harman,et al.  The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics , 1977 .

[35]  D. Berlincourt,et al.  Some Aspects of Dielectric Degradation in Perovskites , 1962 .

[36]  Hiroshi Shiomi Cumulative Degradation Model and its Application to Component Life Estimation , 1965 .

[37]  Edward B. Hakim,et al.  Environmental Factors Governing Field Reliability of Plastic Transistors and Integrated Circuits , 1972 .

[38]  Ralph E. McCullough Screening Techniques for Intermittent Shorts , 1972 .

[39]  E. R. Freeman,et al.  Control of Electrostatic Discharge Damage to Semiconductors , 1974 .

[40]  H. Stuart Dodge Failure Mechanisms in Semiconductors , 1963 .

[41]  Loren W. Linholm,et al.  Electrostatic Gate Protection using an Arc Gap Device , 1973 .

[42]  F. Fischer Moisture Resistance of Plastic Packages for Semiconductor Devices , 1970 .

[43]  A. Kuper,et al.  Phosphosilicate Glass Passivation Against Sodium Impurity in Thermal Oxide on Silicon , 1967 .

[44]  Jack S. Smith High Current Transient Induced Junction Shorts , 1971 .

[45]  R. Hein The Effect of Gas Ambient on the Failure of Traveling-Wave Tubes , 1962 .

[46]  H. Higuchi,et al.  A New Cyclic Biased T.H.B. Test for Power Dissipating IC's , 1979, 17th International Reliability Physics Symposium.

[47]  Charles H. Zierdt Some Circuit Considerations and Operating Precautions for Accelerated HTRB and Operating Testing of Semiconductor Devices , 1971 .

[48]  Donald R. Earles,et al.  Reliability Physics (The Physics of Failure) , 1962 .

[49]  R. Dockerty,et al.  Hot Electron Induced Degradation of N-Channel IGFETs , 1976, 14th International Reliability Physics Symposium.

[50]  J. Black Mass Transport of Aluminum by Momentum Exchange with Conducting Electrons , 1967 .

[51]  C. W. Horsting Purple Plague and Gold Purity , 1972 .

[52]  A. S. Grove,et al.  Mechanisms of Channel Current Formation in Silicon P-N Junctions , 1965 .

[53]  P. H. Eisenberg,et al.  Nichrome Resistors in Programmable Read Only Memory Integrated Circuits , 1974 .

[54]  K. Ravi,et al.  Observations on the Reliability of thin Film Nickel-Chromium Resisiors , 1970 .

[55]  Wilton L. Workman Failure Analysis Techniques , 1964 .

[56]  D. E. Sawyer,et al.  Optical Scanning Techniques for Semiconductor Device Screening and Identification of Surface and Junction Phenomena , 1966 .

[57]  S. Behera,et al.  A Procedure for the Evaluation and Failure Analysis of M.O.S. Memory Circuits using the Scanning Electron Microscope in Potential Contrast Mode , 1972 .

[58]  Robert S. Alwitt,et al.  The Chemistry of Failure of Aluminum Electrolytic Capacitors , 1965 .

[59]  J. R. Bevington,et al.  Plastic IC Reliability Evaluation and Analysis , 1970 .

[60]  R. Anderson On the Degradation of Gallium Arsenide Tunnel Diodes , 1963 .

[61]  N. Klein,et al.  Mechanisms of D-C Electrical Breakdown in Thin Siliconoxide Films , 1964 .

[62]  David Burgess,et al.  Reliability Aspects of Nichrome Fusible Link PROM's (Progammable Read Only Memories) , 1974 .

[63]  Arnold J. Borofsky Component Quality Assurance Programs for Microminiature Electronic Components for Minuteman II , 1964 .

[64]  Aaron Der Marderosian,et al.  Humidity Threshold Variations for Dendrite Growth on Hybrid Substrates , 1977, 15th International Reliability Physics Symposium.

[65]  W. Shockley,et al.  Thermal Instabilities and Hot Spots in Junction Transistors , 1962 .

[66]  Thomas S. Speakman,et al.  A Model for the Failure of Bipolar Silicon Integrated Circuits Subjected to Electrostatic Discharge , 1974 .