Reliability physics in electronics: a historical view
暂无分享,去创建一个
[1] D. S. Peck,et al. The Analysis of Data from Accelerated Stress Tests , 1971 .
[2] Robert W. Thomas. Microcircuit Package Gas Analysis , 1976, 14th International Reliability Physics Symposium.
[3] Robert J. Anstead. Failure Analysis using a Scanning Electron Microscope , 1967 .
[4] C. W. Lewis,et al. Physics of Resistor Failure , 1962 .
[5] J. S. Smith. Electrical Overstress Failure Analysis in Microcircuits , 1978, 16th International Reliability Physics Symposium.
[6] M. Rocci,et al. A Technique for Controllable Acceleration and Prediction of Degradation Mechanisms of Electronic Parts , 1965 .
[7] George H. Ebel. High Temperature Reverse Bias Testing at Wafer Level , 1972 .
[8] J. R. Haberer. Photoresponse Mapping of Semiconductors , 1966 .
[9] Jayne Partridge. On the Extrapolation of Accelerated Stress Conditions to Normal Stress Conditions of Germanium Transistors , 1963 .
[10] H. Schafft,et al. Characteristics of "Second Breakdown" and Transistor Failure , 1962 .
[11] T. May,et al. A New Physical Mechanism for Soft Errors in Dynamic Memories , 1978, 16th International Reliability Physics Symposium.
[12] J. J. Licari,et al. Properties of Plastic Materials and How They Relate to Device Failure Mechanisms , 1965 .
[13] C. S. Tsai,et al. Diagnosis of Hybrid Microelectronics using Transmission Acoustic Microscopy , 1979, 17th International Reliability Physics Symposium.
[14] W. Shurtleff,et al. A Limitation to the Step Stress Testing Concept for Integrated Circuits , 1965 .
[15] Clifford M. Ryerson. Project Control to Provide for the Physics of Failure in Electronics , 1962 .
[16] D. Peck,et al. The Design and Evaluation of Reliable Plastic-Encapsulated Semiconductor Devices , 1970 .
[17] G.H. Ebel. Failure Analysis Techniques Applied in Resolving Hybrid Microcircuit Reliability Problems , 1977, 15th International Reliability Physics Symposium.
[18] A. Christou,et al. Ionic Contamination-Humidity Effects on GaAs FETs , 1979, 17th International Reliability Physics Symposium.
[19] Alex Shumka,et al. Migrated-Gold Resistive Shorts in Microcircuits , 1975, 13th International Reliability Physics Symposium.
[20] Charles Libove. Rectangular Flat-Pack Lids Under External Pressure: Formulas for Screening and Design , 1975, 13th International Reliability Physics Symposium.
[21] Elliott Philofsky. Purple Plague Revisited , 1970 .
[22] Jayne Partridge,et al. The Application of Failure Analysis in Procuring and Screening of Integrated Circuits , 1965 .
[23] D. S. Peck. New Concerns About Integrated Circuit Reliability , 1978, 16th International Reliability Physics Symposium.
[24] Joseph Vaccaro. Reliability and the Physics of Failure Program at RADC , 1962 .
[25] E. E. Davidson,et al. Reliability Implications of Hot Electron Generation and Parasitic Bipolar Action in an IGFET Device , 1976, 14th International Reliability Physics Symposium.
[26] Joseph B. Brauer,et al. Can Plastic Encapsuiated Microcircuits Provide Reliability with Economy , 1970 .
[27] David W. Levinson,et al. Failure Physics: an Essential Discipline for Reliability Engineering , 1962 .
[28] J. Kozol,et al. Failure Physics and Accelerated Testing , 1963 .
[29] George H. Ebel. Physics of Failure in Commercialand , 1964 .
[30] C. A. Bosselaar. Critical Remarks on the Use of Streoscan Electron Microscopes for the Investigation of the Electrical Parameters of Semiconductor Surfaces , 1967 .
[31] L. Zakraysek. Intermetallic Characterization , 1973 .
[32] L. Hamiter,et al. EBIC - A Valuable Tool for Semiconductor Evaluation and Failure Analysis , 1977, 15th International Reliability Physics Symposium.
[33] George G. Harman. A Metallurgical Basis for the Non-Destructive Wire-Bond Pull-Test , 1974 .
[34] G. Harman,et al. The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics , 1977 .
[35] D. Berlincourt,et al. Some Aspects of Dielectric Degradation in Perovskites , 1962 .
[36] Hiroshi Shiomi. Cumulative Degradation Model and its Application to Component Life Estimation , 1965 .
[37] Edward B. Hakim,et al. Environmental Factors Governing Field Reliability of Plastic Transistors and Integrated Circuits , 1972 .
[38] Ralph E. McCullough. Screening Techniques for Intermittent Shorts , 1972 .
[39] E. R. Freeman,et al. Control of Electrostatic Discharge Damage to Semiconductors , 1974 .
[40] H. Stuart Dodge. Failure Mechanisms in Semiconductors , 1963 .
[41] Loren W. Linholm,et al. Electrostatic Gate Protection using an Arc Gap Device , 1973 .
[42] F. Fischer. Moisture Resistance of Plastic Packages for Semiconductor Devices , 1970 .
[43] A. Kuper,et al. Phosphosilicate Glass Passivation Against Sodium Impurity in Thermal Oxide on Silicon , 1967 .
[44] Jack S. Smith. High Current Transient Induced Junction Shorts , 1971 .
[45] R. Hein. The Effect of Gas Ambient on the Failure of Traveling-Wave Tubes , 1962 .
[46] H. Higuchi,et al. A New Cyclic Biased T.H.B. Test for Power Dissipating IC's , 1979, 17th International Reliability Physics Symposium.
[47] Charles H. Zierdt. Some Circuit Considerations and Operating Precautions for Accelerated HTRB and Operating Testing of Semiconductor Devices , 1971 .
[48] Donald R. Earles,et al. Reliability Physics (The Physics of Failure) , 1962 .
[49] R. Dockerty,et al. Hot Electron Induced Degradation of N-Channel IGFETs , 1976, 14th International Reliability Physics Symposium.
[50] J. Black. Mass Transport of Aluminum by Momentum Exchange with Conducting Electrons , 1967 .
[51] C. W. Horsting. Purple Plague and Gold Purity , 1972 .
[52] A. S. Grove,et al. Mechanisms of Channel Current Formation in Silicon P-N Junctions , 1965 .
[53] P. H. Eisenberg,et al. Nichrome Resistors in Programmable Read Only Memory Integrated Circuits , 1974 .
[54] K. Ravi,et al. Observations on the Reliability of thin Film Nickel-Chromium Resisiors , 1970 .
[55] Wilton L. Workman. Failure Analysis Techniques , 1964 .
[56] D. E. Sawyer,et al. Optical Scanning Techniques for Semiconductor Device Screening and Identification of Surface and Junction Phenomena , 1966 .
[57] S. Behera,et al. A Procedure for the Evaluation and Failure Analysis of M.O.S. Memory Circuits using the Scanning Electron Microscope in Potential Contrast Mode , 1972 .
[58] Robert S. Alwitt,et al. The Chemistry of Failure of Aluminum Electrolytic Capacitors , 1965 .
[59] J. R. Bevington,et al. Plastic IC Reliability Evaluation and Analysis , 1970 .
[60] R. Anderson. On the Degradation of Gallium Arsenide Tunnel Diodes , 1963 .
[61] N. Klein,et al. Mechanisms of D-C Electrical Breakdown in Thin Siliconoxide Films , 1964 .
[62] David Burgess,et al. Reliability Aspects of Nichrome Fusible Link PROM's (Progammable Read Only Memories) , 1974 .
[63] Arnold J. Borofsky. Component Quality Assurance Programs for Microminiature Electronic Components for Minuteman II , 1964 .
[64] Aaron Der Marderosian,et al. Humidity Threshold Variations for Dendrite Growth on Hybrid Substrates , 1977, 15th International Reliability Physics Symposium.
[65] W. Shockley,et al. Thermal Instabilities and Hot Spots in Junction Transistors , 1962 .
[66] Thomas S. Speakman,et al. A Model for the Failure of Bipolar Silicon Integrated Circuits Subjected to Electrostatic Discharge , 1974 .