Method for peeling the two elements and device for its implementation

A two elements release process (1, 2) of a structure placed in adherent contact with each other by respective adhesion surfaces, the method comprising a step of applying to a force so localized in an interface area (17) by contacting in the interface area (17) of one and / or the other of said faces with separating means for initiating the detachment of the two elements in the interface area and further, optionally, up to the complete separation of the two elements.