A [10°C; 70°C] 640×480 17µm pixel pitch TEC-less IR bolometer imager with below 50mK and below 4V power supply

Used in low-cost thermal imaging, 8-to-12μm infrared micro-bolometer hybrid detectors are very demanding in terms of offset skimming and technological fluctuation compensation: typical offset values are about 100 times larger than the signal, while the fixed-pattern noise (FPN) is about 10 times larger. State-of-the-art image sensors feature noise-equivalent temperature difference (NETD), i.e. thermal resolutions, of about 50mK.

[1]  N. Shiloah,et al.  Uncooled detector development program at SCD , 2005, SPIE Defense + Commercial Sensing.

[2]  E. Belhaire,et al.  FPN Sources in Bolometric Infrared Detectors , 2009, IEEE Sensors Journal.

[3]  George D. Skidmore,et al.  DRS uncooled VOx infrared detector development and production status , 2010, Defense + Commercial Sensing.

[4]  Michel Vilain,et al.  Uncooled amorphous silicon TEC-less 1/4 VGA IRFPA with 25 μm pixel-pitch for high volume applications , 2008, SPIE Defense + Commercial Sensing.

[5]  Michel Vilain,et al.  VGA 17 μm development for compact, low-power systems , 2011, Defense + Commercial Sensing.