Impact of Line-Edge Roughness on Double-Gate Schottky-Barrier Field-Effect Transistors
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Shimeng Yu | Jinfeng Kang | G. Du | Xiaoyan Liu | Yuning Zhao | R. Han | L. Zeng
[1] Shimeng Yu,et al. The impact of line edge roughness on the stability of a FinFET SRAM , 2009 .
[2] Shimeng Yu,et al. 3-D simulation of geometrical variations impact on nanoscale FinFETs , 2008, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology.
[3] Jinfeng Kang,et al. Impact of stochastic mismatch on FinFETs SRAM cell induced by process variation , 2008, 2008 IEEE International Conference on Electron Devices and Solid-State Circuits.
[4] An analytical 2D current model of Double-Gate Schottky-Barrier MOSFETs , 2008, 2008 International Conference on Simulation of Semiconductor Processes and Devices.
[5] Shimeng Yu,et al. Triple-gate FinFETs with Fin-thickness Optimization to Reduce the Impact of Fin Line Edge Roughness , 2008 .
[6] Tsu-Jae King Liu,et al. A Comparative Study of Dopant-Segregated Schottky and Raised Source/Drain Double-Gate MOSFETs , 2008, IEEE Transactions on Electron Devices.
[7] Shimeng Yu,et al. Full 3-D simulation of gate line edge roughness impact on sub-30nm FinFETs , 2008, 2008 IEEE Silicon Nanoelectronics Workshop.
[8] M. Jurczak,et al. Impact of LER and Random Dopant Fluctuations on FinFET Matching Performance , 2008, IEEE Transactions on Nanotechnology.
[9] R.H. Dennard,et al. An 8T-SRAM for Variability Tolerance and Low-Voltage Operation in High-Performance Caches , 2008, IEEE Journal of Solid-State Circuits.
[10] Threshold Voltage Variation in SOI Schottky-Barrier MOSFETs , 2008, IEEE Transactions on Electron Devices.
[11] Kaushik Roy,et al. FinFET SRAM: Optimizing Silicon Fin Thickness and Fin Ratio to Improve Stability at iso Area , 2007, 2007 IEEE Custom Integrated Circuits Conference.
[12] E.. Baravelli,et al. Impact of Line-Edge Roughness on FinFET Matching Performance , 2007, IEEE Transactions on Electron Devices.
[13] Guo-Qiang Lo,et al. N-channel FinFETs With 25-nm Gate Length and Schottky-Barrier Source and Drain Featuring Ytterbium Silicide , 2007, IEEE Electron Device Letters.
[14] A. Asenov,et al. Simulation Study of Individual and Combined Sources of Intrinsic Parameter Fluctuations in Conventional Nano-MOSFETs , 2006, IEEE Transactions on Electron Devices.
[15] W. Dehaene,et al. Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies , 2006, IEEE Journal of Solid-State Circuits.
[16] A. Asenov,et al. Impact of Random Dopant Fluctuation on Bulk CMOS 6-T SRAM Scaling , 2006, European Solid-State Device Research Conference.
[17] R. Vega. Comparison study of tunneling models for Schottky field effect transistors and the effect of Schottky barrier lowering , 2006, IEEE Transactions on Electron Devices.
[18] J. Larson,et al. Overview and status of metal S/D Schottky-barrier MOSFET technology , 2006, IEEE Transactions on Electron Devices.
[19] Abhinav Kranti,et al. Performance assessment of nanoscale double- and triple-gate FinFETs , 2006 .
[20] R. Rooyackers,et al. Impact of Stochastic Mismatch on Measured SRAM Performance of FinFETs with Resist/Spacer-Defined Fins: Role of Line-Edge-Roughness , 2006, 2006 International Electron Devices Meeting.
[21] J. Knoch,et al. Schottky barrier height modulation using dopant segregation in Schottky-barrier SOI-MOSFETs , 2005, Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005..
[22] E. Dubois,et al. Integration of PtSi-based Schottky-barrier p-MOSFETs with a midgap tungsten gate , 2005, IEEE Transactions on Electron Devices.
[23] Tsu-Jae King,et al. A comparison study of symmetric ultrathin-body double-gate devices with metal source/drain and doped source/drain , 2005, IEEE Transactions on Electron Devices.
[24] Anna W. Topol,et al. Stable SRAM cell design for the 32 nm node and beyond , 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..
[25] N. Collaert,et al. Analysis of the parasitic S/D resistance in multiple-gate FETs , 2005, IEEE Transactions on Electron Devices.
[26] A. Chin,et al. N-type Schottky barrier source/drain MOSFET using ytterbium silicide , 2004, IEEE Electron Device Letters.
[27] J. Koga,et al. Solution for high-performance Schottky-source/drain MOSFETs: Schottky barrier height engineering with dopant segregation technique , 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..
[28] D.S.H. Chan,et al. Schottky-barrier S/D MOSFETs with high-k gate dielectrics and metal-gate electrode , 2004, IEEE Electron Device Letters.
[29] J. Bokor,et al. A simulation study of gate line edge roughness effects on doping profiles of short-channel MOSFET devices , 2004, IEEE Transactions on Electron Devices.
[30] Jae-Heon Shin,et al. A 50-nm-gate-length erbium-silicided n-type Schottky barrier metal-oxide-semiconductor field-effect transistor , 2004 .
[31] Andrew R. Brown,et al. Simulation of intrinsic parameter fluctuations in decananometer and nanometer-scale MOSFETs , 2003 .
[32] A. Asenov,et al. Intrinsic parameter fluctuations in decananometer MOSFETs introduced by gate line edge roughness , 2003 .
[33] Ying Zhang,et al. Extension and source/drain design for high-performance FinFET devices , 2003 .
[34] High-performance p-channel Schottky-barrier SOI FinFET featuring self-aligned PtSi source/drain and electrical junctions , 2003, IEEE Electron Device Letters.
[35] Mark S. Lundstrom,et al. A computational study of thin-body, double-gate, Schottky barrier MOSFETs , 2002 .
[36] J. Bokor,et al. FinFET process refinements for improved mobility and gate work function engineering , 2002, Digest. International Electron Devices Meeting,.
[37] J. Kedzierski,et al. A functional FinFET-DGCMOS SRAM cell , 2002, Digest. International Electron Devices Meeting,.
[38] W. Sansen,et al. Line edge roughness: characterization, modeling and impact on device behavior , 2002, Digest. International Electron Devices Meeting,.
[39] T. Linton,et al. Determination of the line edge roughness specification for 34 nm devices , 2002, Digest. International Electron Devices Meeting,.
[40] Bin Yu,et al. FinFET scaling to 10 nm gate length , 2002, Digest. International Electron Devices Meeting,.
[41] J. Knoch,et al. Impact of the channel thickness on the performance of Schottky barrier metal–oxide–semiconductor field-effect transistors , 2002 .
[42] A. Asenov,et al. Intrinsic threshold voltage fluctuations in decanano MOSFETs due to local oxide thickness variations , 2002 .
[43] R.M.D.A. Velghe,et al. CMOS device optimization for mixed-signal technologies , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).
[44] J. Meindl,et al. The impact of intrinsic device fluctuations on CMOS SRAM cell stability , 2001, IEEE J. Solid State Circuits.
[45] Yuan Taur,et al. Device scaling limits of Si MOSFETs and their application dependencies , 2001, Proc. IEEE.
[46] M. Ieong,et al. Modeling line edge roughness effects in sub 100 nanometer gate length devices , 2000, 2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502).
[47] Chenming Hu,et al. Sub 50-nm FinFET: PMOS , 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).
[48] P. Stolk,et al. The effect of statistical dopant fluctuations on MOS device performance , 1996, International Electron Devices Meeting. Technical Digest.
[49] E. Seevinck,et al. Static-noise margin analysis of MOS SRAM cells , 1987 .