Validity of constant voltage stress based reliability assessment of high-/spl kappa/ devices

Charge trapping in high-/spl kappa/ gate dielectrics affects the result of electrical characterization significantly. DC mobility degradation and device threshold voltage instability and C-V and I-V hysteresis are a few examples. The charging effects in high-/spl kappa/ gate dielectric also affect the validity of conventional reliability test methodologies developed for SiO/sub 2/ devices. In this paper, we review high-/spl kappa/ materials specific phenomena that can affect the validity of constant-voltage-stress-based reliability test methods to address the direction of future reliability study on high-/spl kappa/ devices.

[1]  J. C. Lee,et al.  Dynamic reliability characteristics of ultra-thin HfO/sub 2/ , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[2]  K. Onishi,et al.  Hard and soft-breakdown characteristics of ultra-thin HfO/sub 2/ under dynamic and constant voltage stress , 2002, Digest. International Electron Devices Meeting,.

[3]  Evgeni P. Gusev,et al.  Charge detrapping in HfO2 high-κ gate dielectric stacks , 2003 .

[4]  Tak H. Ning,et al.  Hot-carrier charge trapping and trap generation in HfO2 and Al2O3 field-effect transistors , 2003 .

[5]  G. Bersuker,et al.  Localized transient charging and it's implication on the hot carrier reliability of HfSiON MOSFETs , 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

[6]  John F. Conley,et al.  Electron spin resonance observation of trapped electron centers in atomic-layer-deposited hafnium oxide on Si , 2003 .

[7]  K. Onishi,et al.  Hot carrier reliability of n-MOSFET with ultra-thin HfO/sub 2/ gate dielectric and poly-Si gate , 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

[8]  R. Degraeve,et al.  Correlation between Stress-Induced Leakage Current (SILC) and the HfO/sub 2/ bulk trap density in a SiO/sub 2//HfO/sub 2/ stack , 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

[9]  G. Bersuker,et al.  Intrinsic characteristics of high-k devices and implications of fast transient charging effects (FTCE) , 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

[10]  M. Rosmeulen,et al.  Characterization of the V/sub T/-instability in SiO/sub 2//HfO/sub 2/ gate dielectrics , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[11]  Eduard A. Cartier,et al.  Anode hole injection and trapping in silicon dioxide , 1996 .

[12]  Massimo V. Fischetti,et al.  Charge trapping related threshold voltage instabilities in high permittivity gate dielectric stacks , 2003 .

[13]  Rino Choi,et al.  Dynamic reliability characteristics of ultra-thin HfO 2 , 2003 .

[14]  S.J. Lee,et al.  Reliability projection and polarity dependence of TDDB for ultra thin CVD HfO/sub 2/ gate dielectrics , 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).

[15]  Fischetti Model for the generation of positive charge at the Si-SiO2 interface based on hot-hole injection from the anode. , 1985, Physical review. B, Condensed matter.

[16]  B. H. Lee,et al.  Interfacial Layer-Induced Mobility Degradation in High-k Transistors , 2004 .

[17]  H. Satake,et al.  Significant role of cold carriers for dielectric breakdown in HfSiON , 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..