Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

The fatigue ductility exponent in the Coffin–Manson law for a Sn-Ag-Cu micro-solder joint was investigated in terms of the cyclic strain-hardening property and the inelastic strain energy in fracture for isothermal fatigue. The fatigue ductility exponent was found to increase with temperature and holding time under strain at high temperature. This exponent is closely related to the cyclic strain-hardening exponent, which displays the opposite behavior in that it decreases with increasing temperature and with coarsening of intermetallic compound particles while holding under strain at high temperature. This result differs from the creep damage mechanism (grain boundary fracture), which is a primary reason for the significant reduction in fatigue life for all strain ranges for large-size specimens.

[1]  M. Sakata,et al.  Crystal growth of manganese silicide, MnSi∼1.73 and semiconducting properties of Mn15Si26 , 1981 .

[2]  E. W. Hammer.  Symposium on internal stresses in metals and alloys: organized by The Institute of Metals. 485 pages, 14 × 22 cm., drawings, illustrations and tables. London, The Institute of Metals, 1948. Price, 42s , 1949 .

[3]  C. Ning,et al.  Effects of silica on the bioactivity of calcium phosphate composites in vitro , 2005, Journal of materials science. Materials in medicine.

[4]  M. Otsuka,et al.  Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach , 2001 .

[5]  M. Ashby.  The deformation of plastically non-homogeneous materials , 1970 .

[6]  R. Scattergood,et al.  The strengthening effect of voids , 1982 .

[7]  D. Srolovitz,et al.  Diffusional relaxation of the dislocation-inclusion repulsion , 1983 .

[8]  M. Otsuka,et al.  Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys , 1998 .

[9]  Seong-Gu Hong,et al.  A new energy-based fatigue damage parameter in life prediction of high-temperature structural materials , 2008 .

[10]  Chun-Sing Lee,et al.  A strain energy-based approach to the low-cycle fatigue damage mechanism in a high-strength spring steel , 1998 .

[11]  John H. L. Pang,et al.  CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis , 2000 .

[12]  M. Otsuka,et al.  Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy , 1998 .

[13]  R. Scattergood,et al.  The Orowan mechanism in anisotropic crystals , 1975 .

[14]  Y. Miyashita,et al.  Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn–3.5Ag , 2003 .

[15]  Y. Mutoh,et al.  Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder , 2004 .

[16]  Y. Kariya,et al.  Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint , 2010 .

[17]  Yoshiharu Kariya,et al.  Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint , 2010 .

[18]  Chun-Ming Huang,et al.  Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder , 2006 .

[19]  Yoshiharu Kariya,et al.  Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint , 2008 .

[20]  W. J. Plumbridge,et al.  Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach , 2006 .

[21]  A. Luo,et al.  Low cycle fatigue properties of an extruded AZ31 magnesium alloy , 2009 .

[22]  J. Pang,et al.  Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy , 2004 .