论文信息 - Application of holographic pattern measuring system for deformation analysis of printed circuit board due to thermal stress

Application of holographic pattern measuring system for deformation analysis of printed circuit board due to thermal stress

By using both FEMLAB and the thermography, the thermal pattern was analyzed of thermally stressed printed circuit board along with the deformation pattern by using the holographic pattern measuring system (HPMS). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the HPMS could be effectively used as a tool for analyzing PCB deformation with 3D graphic image.

N. Chubachi | T. Takagi | M. Taniguchi | T. Nethu | K. Kameyama

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