Laterally driven accelerometer fabricated in single crystalline silicon

[1]  J. B. Starr Squeeze-film damping in solid-state accelerometers , 1990, IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop.

[2]  Phillip W. Barth,et al.  Silicon fusion bonding for fabrication of sensors, actuators and microstructures , 1990 .

[3]  W. Maszara,et al.  Role of surface morphology in wafer bonding , 1991 .

[4]  Olof Engström,et al.  Electrical Characterization of Bonding Interfaces , 1992 .

[5]  William C. Tang,et al.  Electrostatic Comb Drive Levitation And Control Method , 1992 .

[6]  Roger T. Howe,et al.  Surface micromachined accelerometers , 1996 .

[7]  Bernhard E. Boser,et al.  A micromachined fully differential lateral accelerometer , 1996, Proceedings of Custom Integrated Circuits Conference.

[8]  Bernhard E. Boser Electronics for micromachined inertial sensors , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).