A Study on the Curing Behavior of Silicone/Polyurethane/Epoxy Blends by Rigid-Body Pendulum Rheometer

This study explored the curing behavior of blends of liquid silicone, polyurethane (PU), and epoxy. We tried using the rigid-body pendulum rheometer (RPR) to analyze the curing behavior of silicone, PU, and epoxy. Morphology of the three-phase polyblends was evaluated by scanning electron microscopy (SEM). The result showed that the rigid-body pendulum rheometer could be used to observe the processing condition of silicon/pu/epoxy blends and their curing behavior changes from a liquid state to a solid state. From SEM, we found that the blend cross section has micropellet distribution and rough with increasing content on epoxy. Finally, we found that blends can be formed between intermolecular and self-cross-linking in interpenetrating polymer networks. Comprehension of the previous information, through the adjustment of soft–hard linkage of blends, they could be used in the future material design according to their antivibration absorption characteristic, adhesion function, and heat resistance function.

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