The hidden link between diffusion-induced recrystallization and ideal strength of metals
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G. Schmitz | T. H. Kim | D. Baither | M. Kasprzak | B. Kruse
[1] G. Schmitz,et al. Concentration characteristics of diffusion-induced recrystallization in Cu/CuAu multilayers of varying lattice mismatch , 2010 .
[2] L. Chen,et al. Ab initio examination of ductility features of fcc metals , 2009 .
[3] G. Schmitz,et al. Diffusion-induced recrystallization in silver–palladium layers , 2008 .
[4] M. Kajihara. Chemical driving force for diffusion-induced recrystallization or diffusion-induced grain boundary migration in a binary system consisting of nonvolatile elements , 2006 .
[5] Sidney Yip,et al. Ideal shear strain of metals and ceramics , 2004 .
[6] O. Penrose. On the elastic driving force in diffusion-induced grain boundary motion , 2004 .
[7] Frans Spaepen,et al. The yield strength of thin copper films on Kapton , 2004 .
[8] G. Schmitz,et al. Interdiffusion and reaction of metals: The influence and relaxation of mismatch-induced stress , 2001 .
[9] D. Yoon. Chemically Induced Interface Migration in Solids , 1989 .
[10] G.Brian Stephenson,et al. Deformation during interdiffusion , 1988 .
[11] J. Cahn,et al. Mechanism for diffusion induced grain boundary migration , 1981 .
[12] M. Hillert,et al. Chemically induced grain boundary migration , 1978 .
[13] F. D. Broeder. Interface reaction and a special form of grain boundary diffusion in the Cr-W system , 1972 .
[14] F. N. Rhines,et al. A New Type of Structure in the α-Copper-Zinc Alloys , 1938, Nature.