Wood‐Derived, Vertically Aligned, and Densely Interconnected 3D SiC Frameworks for Anisotropically Highly Thermoconductive Polymer Composites
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Qiaogen Zhang | Zhongqi Shi | K. Ishizaki | Songsong Xu | L. Hao | Junping Zhao | Bo Wang | J. Yang | Xiaonan Zhou | Zhongyu Wang | Jianfeng Yang