High‐rate vapor deposition and large systems for coating processes

In many branches of national economies the coating of large areas at high rates is a precondition for introducing new products on the market in a profitable manner. In the field of physical vapor deposition fresh ground has been opened up by the use of high‐rate electron beam (EB) evaporation for about 20 yr, and by high‐rate sputtering for about 10 yr. As far as metal coating of substrates at extremely high rates is concerned, high‐rate EB evaporation practically has no competitor. High‐rate sputtering has gained a firm hold in the deposition of alloys and compounds on large areas. Moreover, process extensions also will increase the usability of both techniques in the years to come.