Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy
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Tan Juan Boon | L. C. Wai | N. Jaafar | M. Chew | S. Sivakumar | G. Gunasekaran | K. Kanchet | D. Witarsa | V. Srinivasa | Tc Chai | A. Alastair | J. Woo