论文信息 - Relative Permittivity Variation Surrounding PCB Via Hole Structures

Relative Permittivity Variation Surrounding PCB Via Hole Structures

As integrated circuit technology advancements are pushing data rates to 6 Gb/s and beyond, channel simulations are becoming a necessity. As part of the topology modeling and simulation, the correct value of permittivity surrounding a printed circuit board (PCB) via hole structure is required for better accuracy. This paper presents data to suggest the relative permittivity of the dielectric surrounding a PCB via hole structure in the z-axis direction of a fiberglass reinforced PCB laminate is different from the relative permittivity surrounding a trace etch in the x/y-axis direction of the same PCB.

L. Simonovich

[1] H. Tohya,et al. Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs , 2003, IEEE Microwave and Wireless Components Letters.

[2] Howard W. Johnson,et al. High Speed Signal Propagation: Advanced Black Magic , 2003 .

[3] Losses Induced by Asymmetry in Differential Transmission Lines , 2007 .

[4] Jinghan Yu,et al. Analysis of Via Capacitance in Arbitrary Multilayer PCBs , 2007, IEEE Transactions on Electromagnetic Compatibility.

[5] Eric Bogatin. Signal Integrity - Simplified , 2003 .

[6] Stephen C. Thierauf,et al. High-Speed Circuit Board Signal Integrity , 2004 .

[7] Martin H. Graham,et al. Book Review: High-Speed Digital Design: A Handbook of Black Magic by Howard W. Johnson and Martin Graham: (Prentice-Hall, 1993) , 1993, CARN.