Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

[1]  Vadim V. Silberschmidt,et al.  Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition , 2015 .

[2]  S. Manzetti,et al.  The geometry and electronic structure of Aristolochic acid : possible implications for a frozen resonance , 2013 .

[3]  Nguyen Cao Truong Hai,et al.  Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating , 2012 .

[4]  S. Jayakrishnan,et al.  Effect of organic dye on copper metallization of high aspect ratio through hole for interconnect application , 2012 .

[5]  Peixia Yang,et al.  Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations , 2012 .

[6]  A. Mohamad,et al.  Electrochemical and quantum chemical studies on phthalhydrazide as corrosion inhibitor for mild steel in 1 M HCl solution , 2012, Research on chemical intermediates (Print).

[7]  Marco Arnold,et al.  Classification of suppressor additives based on synergistic and antagonistic ensemble effects , 2011 .

[8]  K. F. Khaled.  Experimental and molecular dynamics study on the inhibition performance of some nitrogen containing compounds for iron corrosion , 2010 .

[9]  Wei-Ping Dow,et al.  Microvia filling by copper electroplating using diazine black as a leveler , 2009 .

[10]  Wei-Ping Dow,et al.  Filling mechanism in microvia metallization by copper electroplating , 2008 .

[11]  Gökhan Gece,et al.  The use of quantum chemical methods in corrosion inhibitor studies , 2008 .

[12]  C. Liang,et al.  Electrochemical and DFT studies of β-amino-alcohols as corrosion inhibitors for brass , 2007 .

[13]  C. Mele,et al.  An electrochemical and in situ SERS study of Cu electrodeposition from acidic sulphate solutions in the presence of 3-diethylamino-7-(4-dimethylaminophenylazo)-5-phenylphenazinium chloride (Janus Green B) , 2006 .

[14]  D. Glossman-Mitnik,et al.  Computational simulation of the molecular structure and properties of heterocyclic organic compounds with possible corrosion inhibition properties , 2005 .

[15]  K. Kondo,et al.  Copper damascene electrodeposition and additives , 2003 .

[16]  D. Stoychev.  On the role of poly(ethylene glycol) in deposition of galvanic copper coatings , 1998 .

[17]  Jacopo Tomasi,et al.  A new integral equation formalism for the polarizable continuum model: Theoretical background and applications to isotropic and anisotropic dielectrics , 1997 .

[18]  H. Y. Cheh,et al.  Modeling of plated through-hole processes , 1996 .

[19]  J. Talbot,et al.  Modeling of the Electroplating of a Through‐Hole Considering Additive Effects and Convection , 1991 .