Modeling temperature dependency (6 – 400K) of the leakage current through the SiO2/high-K stacks

We investigate the mechanism of the gate leakage current in the Si/SiO2/HfO2/TiN stacks in a wide temperature range (6 – 400 K) by simulating the electron transport using a multi-phonon trap assisted tunneling model. Good agreement between simulations and measurements allows indentifying the dominant physical processes controlling the temperature dependency of the gate current. In depletion/weak inversion, the current is limited by the supply of carrier. In strong inversion, the electron-phonon interaction is found to be the dominant factor determining the current voltage and temperature dependencies. These simulations allowed to extract important defect parameters, e.g. the trap relaxation energy and phonon effective energy, which defines the defect atomic structure.

[1]  Kun Huang,et al.  Theory of light absorption and non-radiative transitions in F-centres , 1950, Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences.

[2]  D. Lang,et al.  Nonradiative capture and recombination by multiphonon emission in GaAs and GaP , 1977 .

[3]  K. Ng,et al.  The Physics of Semiconductor Devices , 2019, Springer Proceedings in Physics.

[4]  G. Bersuker,et al.  Temperature (5.6-300K) Dependence Comparison of Carrier Transport Mechanisms in HfO2/SiO2 and SiO2 MOS Gate Stacks , 2008, 2008 IEEE International Integrated Reliability Workshop Final Report.

[5]  Luca Larcher,et al.  Statistical simulation of leakage currents in MOS and flash memory devices with a new multiphonon trap-assisted tunneling model , 2003 .

[6]  T. Ma,et al.  Inelastic electron tunneling spectroscopy study of ultrathin HfO2 and HfAlO , 2003 .

[7]  L. Larcher,et al.  Breakdown in the metal/high-k gate stack: Identifying the “weak link” in the multilayer dielectric , 2008, 2008 IEEE International Electron Devices Meeting.

[8]  Gennadi Bersuker,et al.  Limitations of Poole–Frenkel Conduction in Bilayer $\hbox{HfO}_{2}/\hbox{SiO}_{2}$ MOS Devices , 2010, IEEE Transactions on Device and Materials Reliability.

[9]  J. Wortman,et al.  Modeling study of ultrathin gate oxides using direct tunneling current and capacitance-voltage measurements in MOS devices , 1999 .

[10]  L. Mao Modeling of temperature dependence of the leakage current through a hafnium silicate gate dielectric in a MOS device , 2007 .