论文信息 - RF SAW filter package design for wireless communications

RF SAW filter package design for wireless communications

This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full-wave analysis. A novel port configuration is used in finite-element simulation. Agreement between measurement and simulation is found to be excellent. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 399–401, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11229

Thomas X. Wu | Xiaomin Yang | Craig Finch | Benjamin Abbott

[1] B. Beker,et al. Effects of package parasitics on the performance of SAW filters , 1996, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[2] T. Makkonen,et al. Electromagnetic modeling of package parasitics in SAW-duplexer , 1996, 1996 IEEE Ultrasonics Symposium. Proceedings.

[3] Raj Mittra,et al. An FDTD-Touchstone hybrid technique for equivalent circuit modeling of SOP electronic packages , 1997 .

[4] T. Nishihara,et al. Development of low-loss band-pass filters using SAW resonators for portable telephones , 1992, IEEE 1992 Ultrasonics Symposium Proceedings.

[5] T. Arnborg,et al. A novel approach to 3-D modeling of packaged RF power transistors , 1999 .