Simulation and optimization of a micro-machined silicon condenser microphone using a perforated diaphragm

A method was proposed to analyze silicon condenser microphone using a perforated diaphragm. Different from the microphone with back-holes, the acoustic holes are made on the diaphragm, which avoids making the holes on the back plate and etching the back chamber. For the microphone with this structure, a new analysis method was proposed, which combines the microphone equivalent circuit and finite element analysis, establish a more accurate microphone equivalent circuit. On this basis, we studied the effects of diaphragm area, microphone acoustic hole and air gap on the microphone performance, which can provide the theoretical guidance for the design of microphone. Finally, the steepest descent is used to optimize the structure of the microphone. The sensitivity of the optimized structure is -41.6dB with the pull-in voltage is 12V, and the frequency response in 20Hz-20.6kHz is flat.

[1]  Rongming Lin,et al.  Modeling and characterization of a silicon condenser microphone , 2004 .

[2]  A. Faes,et al.  MODELING OF A CONDENSER MICROPHONE WITH STRUCTURED POLYSILICON DIAPHRAGM , 2005 .

[3]  B.Y. Majlis,et al.  Condenser microphone performance simulation using equivalent circuit method , 2004, 2004 IEEE International Conference on Semiconductor Electronics.

[4]  Wouter Olthuis,et al.  A review of silicon microphones , 1994 .

[5]  Capacitive microphone fabricated with CMOS-MEMS surface-micromachining technology , 2011, 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP).

[6]  Hyu-Sang Kwon,et al.  Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology , 2007 .

[7]  Elmar Schröder,et al.  Determining The Acoustic Resistance of Small Sound Holes for MEMS Microphones , 2011 .

[8]  Minhang Bao,et al.  Squeeze film air damping in MEMS , 2007 .

[9]  Chang Han Je,et al.  The Novel Sensitivity Improved Surface Micromachined MEMS Microphone with the Center-Hole Membrane , 2011 .

[10]  W. Kühnel,et al.  A silicon condenser microphone with structured back plate and silicon nitride membrane , 1992 .

[11]  Burhanuddin Yeop Majlis,et al.  Design and fabrication of a new MEMS capacitive microphone using a perforated aluminum diaphragm , 2009 .

[12]  Kensall D. Wise,et al.  A high sensitivity polysilicon diaphragm condenser microphone , 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.

[13]  J. Bergqvist Finite-element modelling and characterization of a silicon condenser microphone with a highly perforated backplate , 1993 .

[14]  F. Parodi,et al.  A silicon condenser microphone with a highly perforated backplate , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.