RECENT RESULTS USING MET-VIA TSV INTERPOSER TECHNOLOGY AS TMV ELEMENT IN WAFER LEVEL THROUGH MOLD VIA PACKAGING OF CMOS BIOSENSORS

This paper reports on the successful manufacture of metalized TSV interposer technology as a through molded via element in wafer level packaging of CMOS biosensors. The work has been executed by Silex Microsystems and Fraunhofer IZM, within the EUconsortium CAJAL4EU, where originally 29 partners were developing nanoelectronics-based biosensor technology platforms [1]. The finished metalized TSV interposers fabricated by Silex’s 8” line were electrically characterized before molding and showed low resistance (mean resistance 10.3mΩ/Via, with σ of 2.4) and a high yield of 99.6 %.The Chip in Polymer (CiP) Reconfigured wafers was fabricated by IZM. The TSV interposers and CMOS biosensor chips die were interconnected using a PCB based redistribution allowing low-cost heterogeneous integrated packaging and separation between the active biosensor with wet I/Os and the dry electrical connections. The finished assembled package with the bio-sensor were optically inspected by X-ray CT, X-ray, cross sectioning and SEM. Preliminary results indicates that the complete molded module has an electrical contact, from topbottom-top, with a resistance of 1-3Ω.