Scattering analysis of optical components in the DUV

Driven by the increasing demands on optical components for DUV lithography, a system for angle resolved as well as total scatter measurements (ARS and TS respectively) at 193 nm and 157 nm has been developed at the Fraunhofer Institute in Jena. Extremely low background scattering levels of 10-6 for the TS measurements and more than 12 orders of magnitude dynamic range for ARS have been accomplished. The variety of components to be measured extends from super-smooth substrates with sub-nanometer roughness to multilayer systems with pronounced nanostructures. Examples are presented for scatter analysis of DUV dielectric multilayers as well as for roughness analysis of super-smooth EUV mirrors.