论文信息 - 3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm2 bandwidth densities for future co-packaged chipsets. © 2021 The Author(s)

[1] K. Bergman,et al. Ultra-Broadband Interleaver for Extreme Wavelength Scaling in Silicon Photonic Links , 2020, IEEE Photonics Technology Letters.

[2] Douglas D. Coolbaugh,et al. The AIM Photonics MPW: A Highly Accessible Cutting Edge Technology for Rapid Prototyping of Photonic Integrated Circuits , 2019, IEEE Journal of Selected Topics in Quantum Electronics.

[3] Michal Lipson,et al. Photonic-chip-based frequency combs , 2019, Nature Photonics.

[4] Qixiang Cheng,et al. Optical interconnection networks for high-performance systems , 2020, Optical Fiber Telecommunications VII.