Influence of oxygen on rate-controlling mechanisms in hot deformation of polycrystalline copper: oxygen-free versus electrolytic grades

[1]  Z. Guo,et al.  Coupled quantitative simulation of microstructural evolution and plastic flow during dynamic recrystallization , 2001 .

[2]  H. Miura,et al.  Dynamic recrystallization of copper polycrystals with different purities , 1999 .

[3]  P. Klimanek,et al.  The influence of temperature and strain rate on microstructural evolution of polycrystalline copper , 1997 .

[4]  U. F. Kocks,et al.  On the strain-rate dependence of dynamic recrystallization in copper polycrystals , 1992 .

[5]  N. Ravichandran,et al.  Influence of oxygen on dynamic recrystallization during hot working of polycrystalline copper , 1992 .

[6]  A. Korbel,et al.  Effect of multipeak dynamic recrystallisation on structure of deformed and annealed copper , 1989 .

[7]  M. Ashby,et al.  On dynamic recrystallisation , 1987 .

[8]  Tadahisa Nakamura,et al.  Factors affecting dynamic recrystallization of metals and alloys , 1987 .

[9]  G. Neumann,et al.  Monovacancy and divacancy contributions to self-diffusion in face-centred cubic metals reanalysis for copper, silver, gold, nickel and platinum , 1986 .

[10]  C. M. Sellars,et al.  Dynamic recrystallization in nickel and nickel-iron alloys during high temperature deformation , 1969 .

[11]  Chr. Herzig,et al.  Grain boundary diffusion: fundamentals to recent developments , 1997 .

[12]  Lawrence H. Bennett,et al.  Binary alloy phase diagrams , 1986 .

[13]  R. Balluffi.  On measurements of self‐diffusion rates along dislocations in F.C.C. Metals , 1970 .