论文信息 - Two-Dimensional h-BN and MoS2 as Diffusion Barriers for Ultra-Scaled Copper Interconnects - 字舞流文

Two-Dimensional h-BN and MoS2 as Diffusion Barriers for Ultra-Scaled Copper Interconnects

Moon J. Kim | E. Pop | Chun-Li Lo | Zhihong Chen | M. Catalano | Shengjiao Zhang | K. Smithe | Luhua Wang