State of the art of efficient pumped two-phase flow cooling technologies

Abstract In this paper, different pumped two-phase flow cooling technologies for electronic components are presented. Since electronic components heat dissipation requirements are growing, cooling technologies have evolved from air cooled heat exchanger to technologies involving the use of single or two-phase refrigerants. This review focuses on three technologies that allow dissipation of heat flux over 100 W/cm2: Micro-channels, plate-fin and spray cooling. Macroscopic, microscopic–nanoscopic and hybrid heat enhancements for all three technologies are also presented.

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