Nitride film surface properties to reduce nitride residue

Particles and residues occurred during Nitride (OD) layer process have serious effects on the quality for VLSI manufacturing, especially occurred in Nitride deposition and photo developing process play a main killing role of wafer yield and device function. Using KLA-2132 tool, found many Nitride residues caused field oxide missing result in yield loss. After researching, we found Nitride film surface properties have a great relationship with above residues.