On the permanent component profiling of the negative bias temperature instability in p-MOSFET devices
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Hakim Tahi | Boualem Djezzar | Abdelmadjid Benabdelmoumene | Mohamed Goudjil | Amel Chenouf | Youcef Kribes
[1] K. Leong,et al. Are Interface State Generation and Positive Oxide Charge Trapping Under Negative-Bias Temperature Stressing Correlated or Coupled? , 2012, IEEE Transactions on Electron Devices.
[2] Hakim Tahi,et al. Investigation of interface, shallow and deep oxide traps under NBTI stress using charge pumping technique , 2014, Microelectron. Reliab..
[3] Ming-Fu Li,et al. On-The-Fly Interface Trap Measurement and Its Impact on the Understanding of NBTI Mechanism for p-MOSFETs with SiON Gate Dielectric , 2007, 2007 IEEE International Electron Devices Meeting.
[4] G. Groeseneken,et al. On the geometric component of charge-pumping current in MOSFETs , 1993, IEEE Electron Device Letters.
[5] L. Tsetseris,et al. Hydrogen-Related Instabilities in MOS Devices Under Bias Temperature Stress , 2007, IEEE Transactions on Device and Materials Reliability.
[6] Tibor Grasser,et al. Refined NBTI characterization of arbitrarily stressed PMOS devices at ultra-low and unique temperatures , 2013, Microelectron. Reliab..
[7] T. Grasser,et al. The time dependent defect spectroscopy (TDDS) for the characterization of the bias temperature instability , 2010, 2010 IEEE International Reliability Physics Symposium.
[8] E. Poindexter,et al. Chemical and Structural Features of Inherent and Process-Induced Defects in Oxidized Silicon , 1988 .
[9] Marvin H. White,et al. Theory and application of charge pumping for the characterization of Si-SiO/sub 2/ interface and near-interface oxide traps , 1994 .
[10] S. Mukhopadhyay,et al. A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs , 2014, Microelectron. Reliab..
[11] V. Huard. Two independent components modeling for Negative Bias Temperature Instability , 2010, 2010 IEEE International Reliability Physics Symposium.
[12] K. Jeppson,et al. Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices , 1977 .
[13] Y. Maneglia,et al. Extraction of slow oxide trap concentration profiles in metal–oxide–semiconductor transistors using the charge pumping method , 1996 .
[14] Ogawa,et al. Generalized diffusion-reaction model for the low-field charge-buildup instability at the Si-SiO2 interface. , 1995, Physical review. B, Condensed matter.
[15] Gennadi Bersuker,et al. Analysis of Charge-Pumping Data for Identification of Dielectric Defects , 2013, IEEE Transactions on Electron Devices.
[16] D. Ang,et al. Reassessing the Mechanisms of Negative-Bias Temperature Instability by Repetitive Stress/Relaxation Experiments , 2011, IEEE Transactions on Device and Materials Reliability.
[17] D. Fleetwood. Fast and slow border traps in MOS devices , 1995 .
[18] M. Nelhiebel,et al. A two-stage model for negative bias temperature instability , 2009, 2009 IEEE International Reliability Physics Symposium.
[19] Tibor Grasser,et al. Dependence of the negative bias temperature instability on the gate oxide thickness , 2010, 2010 IEEE International Reliability Physics Symposium.
[20] T. Grasser,et al. Evidence for Pb center-hydrogen complexes after subjecting PMOS devices to NBTI stress - A combined DCIV/SDR study , 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).
[21] S. Mahapatra,et al. Recent Issues in Negative-Bias Temperature Instability: Initial Degradation, Field Dependence of Interface Trap Generation, Hole Trapping Effects, and Relaxation , 2007, IEEE Transactions on Electron Devices.
[22] G. Groeseneken,et al. A reliable approach to charge-pumping measurements in MOS transistors , 1984, IEEE Transactions on Electron Devices.
[23] M. Alam,et al. A Comparative Study of Different Physics-Based NBTI Models , 2013, IEEE Transactions on Electron Devices.
[24] F. Heiman,et al. The effects of oxide traps on the MOS capacitance , 1965 .
[25] F. Rahmoune,et al. On the Si–SiO2 interface trap time constant distribution in metal-oxide-semiconductor transistors , 2005 .
[26] S.S. Chung,et al. A novel and direct determination of the interface traps in sub-100 nm CMOS devices with direct tunneling regime (12/spl sim/16 A) gate oxide , 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).
[27] M. Nelhiebel,et al. The Paradigm Shift in Understanding the Bias Temperature Instability: From Reaction–Diffusion to Switching Oxide Traps , 2011, IEEE Transactions on Electron Devices.
[28] Joe W. McPherson,et al. Determination of the nature of molecular bonding in silica from time-dependent dielectric breakdown data , 2004 .
[29] A. Pasquarello,et al. Alignment of hydrogen-related defect levels at the Si-SiO2 interface , 2007 .
[30] B. Kaczer,et al. Do NBTI-induced interface states show fast recovery? A study using a corrected on-the-fly charge-pumping measurement technique , 2009, 2009 IEEE International Reliability Physics Symposium.
[31] J. Suehle,et al. Spectroscopic charge pumping investigation of the amphoteric nature of Si/SiO2 interface states , 2011 .
[32] peixiong zhao,et al. Oxide Traps, Border Traps, and Interface Traps in SiO2 , 2008 .
[33] D. Schroder,et al. Negative bias temperature instability: Road to cross in deep submicron silicon semiconductor manufacturing , 2003 .
[34] D. Ang,et al. Can the reaction-diffusion model explain generation and recovery of interface states contributing to NBTI? , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).
[35] M. Nelhiebel,et al. The ‘permanent’ component of NBTI: Composition and annealing , 2011, 2011 International Reliability Physics Symposium.
[36] D. Varghese,et al. A comprehensive model for PMOS NBTI degradation: Recent progress , 2007, Microelectron. Reliab..
[37] M. Denais,et al. NBTI degradation: From physical mechanisms to modelling , 2006, Microelectron. Reliab..
[38] F. J. Grunthaner,et al. Chemical and electronic structure of the SiO2/Si interface , 1987 .
[39] Hyungcheol Shin,et al. Characterization of Border Trap Density With the Multifrequency Charge Pumping Technique in Dual-Layer Gate Oxide , 2011, IEEE Transactions on Electron Devices.
[40] Hakim Tahi,et al. A New Method for Negative Bias Temperature Instability Assessment in P-Channel Metal Oxide Semiconductor Transistors , 2012 .
[41] J. Suehle,et al. Frequency dependent charge pumping — A defect depth profiling tool? , 2012, 2012 IEEE International Integrated Reliability Workshop Final Report.
[42] D. Bauza,et al. Near interface oxide trap capture kinetics in metal-oxide-semiconductor transistors: Modeling and measurements , 1998 .
[43] G. Bersuker,et al. Comprehensive analysis of charge pumping data for trap identification , 2011, 2011 International Reliability Physics Symposium.
[44] J. McPherson. Quantum Mechanical Treatment of Si-O Bond Breakage in Silica Under Time Dependent Dielectric Breakdown Testing , 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.
[45] R. Wallace. Dielectric Materials for Microelectronics , 2017 .
[46] M.A. Alam,et al. Exploring the Capability of Multifrequency Charge Pumping in Resolving Location and Energy Levels of Traps Within Dielectric , 2008, IEEE Transactions on Electron Devices.