Inductive effects on crosstalk evaluation

Coupling noise between adjacent interconnect lines has become more significant in deep submicron technologies. From an electromagnetic analysis, this coupling noise is determined with respect to the different parameters and a comparison is made between distributed RC and RLC models to represent the interconnection. It is shown that the inductive effects cannot be neglected and a corrective term is proposed to improve the accuracy of the RC model. Our analytical expression is validated through the different parameters involved.

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