论文信息 - Micro-springs for temporary chip connections

Micro-springs for temporary chip connections

The idea of Composite IC is an assembly concept for multi-chip assembly that allows to detect and exchange defective components before final mounting and encapsulation. This paper describes the fabrication process and the characterization of a scalable micro-spring design that has the potential of meeting the mechanical requirements of the Composite IC concept. An FEM simulation model capable of predicting the mechanical properties of future design variations is shown.

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