Failure mechanisms and qualification testing of passive components
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W. Werner | Yves Ousten | A. Dehbi | G. Lekens | H. A. Post | P. Letullier | T. Briolat | R. Humke | R. Schuhmann | K. Saarinen
[1] Y. Danto,et al. The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies , 1997, Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits.