Thermal implications of mobile 3D-ICs

In this paper, we introduce a fast and accurate 3D thermal analysis methodology for sequential face-to-back (F2B) and parallel face-to-face (F2F) 3D integration technologies. Our proposed models take design floorplan and the corresponding power map with temperature-dependent leakage power component and accurately estimate the temperature of any given location in the design. We show that our models are within less than 1% of commercial-grade finite-volume models while they are 100X faster. In addition, we demonstrate the minimum power reduction required in mobile 3D-ICs to achieve similar thermal behaviour of that of the corresponding 2D-ICs. Subsequently, we provide guidelines on 3D partitioning / floorplanning to further improve thermal profile of 3D-ICs.

[1]  Sung Kyu Lim,et al.  Design and CAD methodologies for low power gate-level monolithic 3D ICs , 2014, 2014 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED).

[2]  Sung Kyu Lim,et al.  High-density integration of functional modules using monolithic 3D-IC technology , 2013, 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC).

[3]  J. Mazurier,et al.  Advances, challenges and opportunities in 3D CMOS sequential integration , 2011, 2011 International Electron Devices Meeting.

[4]  Sarma B. K. Vrudhula,et al.  Fast and Accurate Prediction of the Steady-State Throughput of Multicore Processors Under Thermal Constraints , 2009, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[5]  Sung Kyu Lim,et al.  On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective , 2014, 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC).

[6]  Thomas Ernst,et al.  3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS , 2012, IEEE Journal on Emerging and Selected Topics in Circuits and Systems.

[7]  Kevin Skadron,et al.  An Improved Block-Based Thermal Model in HotSpot 4.0 with Granularity Considerations , 2007 .

[8]  A. Toffoli,et al.  Advances in 3D CMOS sequential integration , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

[9]  David Atienza,et al.  3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling , 2010, 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).